@inproceedings{daggitt-2023-compiling, series={CPP ’23}, title={Compiling Higher-Order Specifications to SMT Solvers: How to Deal with Rejection Constructively}, url={http://dx.doi.org/10.1145/3573105.3575674}, DOI={10.1145/3573105.3575674}, booktitle={Proceedings of the 12th ACM SIGPLAN International Conference on Certified Programs and Proofs}, publisher={ACM}, author={Daggitt, Matthew L. and Atkey, Robert and Kokke, Wen and Komendantskaya, Ekaterina and Arnaboldi, Luca}, year={2023}, month=Jan, pages={102–120}, collection={CPP ’23} }